ArNi® wire was designed by Shunyata Research to be the finest quality wire available. It begins with the highest purity of copper and silver metals available, including Ohno (single crystal), PCOCC silver and OFE C0101 conductors. Fluorocarbon dielectrics, usually only found in aerospace applications that have exceptional electrical characteristics including extremely low dielectric absorption, high dielectric strength and superb heat resistance. When used in digital wiring it significantly reduces transient energy storage and release which affects phase noise performance.
— And finally every cable undergoes our proprietary KPIP™ process.
VTX-Ag cables are uniquely constructed with both an inner, center conductor made of pure silver and an outer concentric ring conductor made of pure copper. It is made using the finest fluorocarbon insulation to minimize dielectric absorption and re-radiation which translates to an improvement in resolution and clarity. VTX-Ag delivers the speed and clarity of silver and the midrange warmth and three dimensional power in the lower octaves of copper without imparting any of the negatives associated with either metal.
— The best qualities of silver and copper combined.
Shunyata Research uses only the highest purity of copper available for the production of its wire products. OFE Alloy 101 or C10100 is the highest grade of copper with a minimum 99.99% purity and a conductivity rating of 101% IACS. OFE stands for oxygen-free electrolytic and supersedes the term OFHC (oxygen-free high conductivity). C10100 is the only grade of copper that comes with a written certification of purity.
— Certified by ASTM F68 C10100
Simple crimping, soldering, brazing and screws are all inferior methods of joining two wires or terminals together. Sonic welding uses high-energy sonic waves to literally join two metals together at a molecular level and cold-welding uses high-energy pneumatic pressure to bond metals. Shunyata Research uses both methods to secure connections that do not degrade over time.
— Superior contact and wire connections.
Kinetic Phase Inversion Processing
Kinetic Phase Inversion Processing was developed by Caelin Gabriel after years of research into the underlying causes of various effects such as burn-in, wire directionality and the effects of cryogenic treatment. He discovered that there was an underlying core principle that burn-in and cryogenics only partially addressed. Once the governing principle was understood it became possible to create a processor that reduces the need for long burn-in periods and eliminates the effects of cryogenic treatment. Four-days of continuous KPIP™ processing dramatically reduces the sonic ups and downs associated with burn-in, delivering a relaxed and natural presentation.